High-power LGA socket

ABSTRACT

A system for providing electrical contacts between a die and an electrical device includes a die and a package. The package includes a first major surface, a second major surface, a first scalloped edge, a second scalloped edge and a solid end adapted for insertion into a slot. The solid end and the scalloped edges carry current greater than the current needed for an input/output signal. The socket includes a base having an opening therein adapted to receive the package. A slot is located at one end of the opening in the base. The slot is provided with a plurality of conductors for carrying currents greater than the current needed for an input/output signal. A first edge and second edge of the opening include a plurality of spaced overhangs positioned over the opening. The overhangs are sloped with respect to the major planar surface.

RELATED APPLICATION(S)

This application is a divisional of U.S. application Ser. No.10/159,084, filed on May 29, 2002 which is incorporated herein byreference.

FIELD OF THE INVENTION

The present invention relates to a package for a semiconductor device,and specifically to a package for semiconductor devices that use a landgrid array.

BACKGROUND OF THE INVENTION

As more and more capability is being designed into semiconductordevices, such as memory modules and microprocessors, there are anincreasing number of leads or input/output elements being placed ontoelectronics packages. In the past, peripherally leaded packages providedan adequate number of leads or input/output elements. Peripherallyleaded packages have leads or input/output elements along the edges ofthe electronic component. In many applications, such packages provide anadequate number of input/output elements. In the past few years,however, many semiconductor devices have required more input/outputelements than provided in a peripherally leaded package.

To provide additional electrical contacts for a semiconductor device,many have used a grid array package. In a grid array package theinput/output elements are placed on the surface of the semiconductordevices. The grid array packages have many advantages, includingsimplicity, high contact density, and extremely low inductance due tothe short paths between the contact and the element within thesemiconductor device. There are several types of grid arrays. Ball gridarrays and chip scale packages have hemispherical solder balls asinput/output elements. Pin grid arrays have gold plated pins asinput/output elements. Land grid arrays have flat, gold plated pads asinput/output elements.

In general, the grid array packages are lower cost solutions than theperipherally leaded packages. Of the grid array packages, the mostsimple and least costly is the land grid array package. Most of the gridarray packages have been successfully implemented in products. However,the land grid array packages have technical limitations that stand inthe way of wide acceptance of this technology in a useable product. Thetechnical limitations include the fact that land grid array packageshave limited current carrying capability. Currently, the lands of theland grid array are used either to carry input/output signals or tocarry power. Simply put, the capability of the individual lands to carrypower is limited due to the small size of the land grid array and theelectrical connections made to the land grid array. This limits theamount of power that can be input to such packages.

Another technical problem with land grid array packages is that there isa short wiping distance between the land and the contact as the contactis initially placed in contact with the land. The wiping distance is thelength of travel between an individual land or pad of the land gridarray and the contact which is placed in electrical communication withthe pad. Generally, longer wiping distances are preferred since thelonger wiping distance tends to insure penetration of any oxide layer onthe individual land or pad, so that a good electrical contact is made.

There is a growing demand for high loads and evenly distributed loads ona die package. Current land grid array packages have difficulty inhandling a high load and difficulty in distributing the load on thepackages evenly. This lacking is yet another technical hurdle thatstands in the way of acceptance of land grid arrays becoming a widelyused packaging technique in various products.

Thus, there is a need for a land grid array packaging method andapparatus that allows the simple, high contact density, low inductanceland grid array solution to become widely used. There is a need toovercome the limited current carrying capability of the land grid arraypackage. There is a further need to lengthen the typical short wipingdistance to assure reliably good electrical contact between the contactsand the individual lands. There is also a need to meet the demand forhigh and evenly distributed die loads.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is pointed out with particularity in the appended claims.However, a more complete understanding of the present invention may bederived by referring to the detailed description when considered inconnection with the figures, wherein like reference numbers refer tosimilar items throughout the figures, and:

FIG. 1 illustrates a perspective view of a prior art land grid arraypackage.

FIG. 2 illustrates a perspective view of a land grid array package ofthis invention.

FIG. 3 illustrates a bottom perspective view of the land grid arraypackage of this invention.

FIG. 4 illustrates a perspective view of a socket for the land gridarray package of this invention.

FIG. 5 illustrates a scalloped edge of the socket along line 5-5 in FIG.4 of this invention.

FIG. 6 shows another embodiment of this invention wherein the springcontacts are angled with respect to the major surface of the socket.

FIG. 7 illustrates a cut away view of the cam of this invention alongline 7-7 in FIG. 4.

FIG. 8 illustrates a schematic view of computer system which includesthis invention.

The description set out herein illustrates the various embodiments ofthe invention and such description is not intended to be construed aslimiting in any manner.

DETAILED DESCRIPTION

FIG. 1 illustrates a perspective top view of a prior art land grid arraytype package 100. The land grid array package includes a substrate 110to which a die 120 is attached. The substrate includes a first majorsurface 112 and a second major surface 114. The die 120 is attached tothe first major surface 112 of the substrate 110. Located on the secondmajor surface 114 of the substrate 110 is an array of lands. The landscarry both input/output signals to and from the electronics locatedwithin the die 120, as well as the current for power as required by theelectronics within the die 120. Thus, the land grid array type package100 of the prior art has the land carrying both the currents necessaryfor power, as well as the signal level currents for input and output tothe electronics within the die 120. The die 120 fits within acorresponding socket 130 that includes a base 132 having an opening 134therein. At the bottom of the opening 134 is a major surface 136, whichincludes a plurality of electrical contacts 138 for contacting the landson the major surface 114 of the land grid array package 100.

Although the lands on the land grid array package 100 are closely spacedand therefore provide for an economical package with short conductorlinks, there are major problems associated with the prior art land gridarray package 100 and socket 130 designs. Namely, the lands of the landgrid array device 100 carry both power as well as signal level currentsacross the various lands of the land grid array device 100. As a result,the amount of power that can be used to run the electronics within thedie 120 is limited. In addition, the land grid array package 100 isbrought straight down into contact with the socket 130. The problem isthat the individual contacts 138 do not have an adequate wiping distancein order to assure that there is good electrical contact made betweenthe individual lands and the individual contacts 138.

FIGS. 2 and 3 illustrate respective perspective views of a land gridarray package 200 of this invention. FIG. 2 shows a top perspective viewof the land grid array package 200, and FIG. 3 illustrates a bottomperspective view of the land grid array package 200 of this invention.The land grid array package includes a substrate 210 which has a firstmajor surface 212 and a second major surface 214. A die 120 is attachedto the first major surface 212 of the substrate 210. The die 120includes electronics, such as a microprocessor or other semiconductordevice. The die 120 includes inputs and outputs which are attached toconnectors on the first major surface 212 of the substrate 210. Thesubstrate 210 includes a first scalloped edge 220 and a second scallopededge 222. The scalloped edges 220, 222 form a postage-stamp style edge.The substrate 210 also includes a solid end 230. The solid end 230 andthe scalloped edges 220, 222 are capable of carrying high levels ofcurrent associated with powering the die 120 attached to the substrate210.

FIG. 3 illustrates a bottom perspective view of the land grid arraypackage 200. FIG. 3 shows the first scalloped edge 220 and the secondscalloped edge 222, as well as the solid elongated end 230. The secondmajor surface 214 of the land grid array package 200 is shown in FIG. 3.The second major surface 214 includes an array of lands 310 which areused to contact separate contacts in a corresponding socket. Thecorresponding socket will be discussed with respect to FIG. 4. Thepackage 200 is advantageous in that it separates the function ofcarrying current for inputs/outputs from the function of carryingcurrent to power the die 120. In other words, the chip is powered bydelivering higher current levels to the solid end 230 of the land gridarray package 200. The scalloped edges 220, 222 may also be used tocarry higher levels of current to power the electronics within the die120. Thus, there is no need to deliver power via individual lands 310 onthe second major surface 214 of the die 200. In other words, the powercarrying function is removed from the individual lands 310 on the secondmajor surface 214 of the substrate 210. The lands 310 therefore carryinput/output signals between the die 120 and the contacts on the socket.

FIG. 4 illustrates a perspective view of a socket 400 for the land gridarray package of this invention. The land grid array socket 400 includesa base 410 having an opening 412. The socket includes a major surface420 located at the bottom of the opening 412 in the base 410. The majorsurface 420 includes an array of individual contact elements 430 forcontacting the individual lands 310 on the land grid array package 200(shown in FIGS. 2 and 3). The substrate includes a first overhang 440along one edge of the opening 412 and a second overhang 442 along asecond edge of the opening 412. The overhangs 440 and 442 may be singleor, as shown in FIG. 4, the overhangs are a series or plurality ofoverhangs which occur upon their respective edges of the opening 412.The opening also includes a slot 450 along another edge of the opening412. The slot 450 includes electrical contacts 452. The individualelectrical contacts 452 are substantial enough to allow a selected levelof power to be delivered to the solid end 210 of the land grid arraypackage 200 (shown in FIGS. 2 and 3). The socket 400 also includes alever arm 460. The lever arm 460 is capable of a number of positions andmoves a cam within an end 416 of the socket 400. The base 410 includes astop 414 for limiting the position of the lever arm 460. The cam will bediscussed with respect to FIG. 7.

FIG. 5 illustrates a scalloped edge 412 of the land grid array socket400 (shown in FIG. 4) of this invention. A cross-sectional view showsthe edge of the opening 412 that includes the overhang 440. Thecross-sectional view also shows the major surface 420 and the individualcontacts 430 positioned or attached to the major surface 420. Also shownin the cross-sectional view is the slot 450 and the individual contacts452 that are used to deliver power to the solid edge 230 of the landgrid array package 200 (shown in FIGS. 2 and 3). It should be noted thatthe overhangs 440 include an inclined or ramped surface 444. The rampsurface 444 is sloped. The slope of the surface 444 results in varyingdistances between the surface 444 and the major surface 420 of thesocket 400. In essence, each of the overhangs 440 includes a firstportion where the surface 444 is located at a first distance away fromthe major surface 420, as well as a second portion wherein the surface444 is located at a second distance from the major surface 420 of thesocket 400. The first distance is denoted by the reference numeral d₁ inFIG. 5, and the second distance is referenced by the letter d₂ in FIG.5. The distance d₁ is shorter than the distance d₂ due to the slope.

FIG. 6 shows another embodiment of the invention wherein the springcontact 630 makes an angle less than 90 degrees with respect to themajor surface 420 of the opening 412.

FIG. 7 shows a cutaway view of a cam 700 of this invention along line7-7 in FIG. 4. The cam 700 includes an axis 710 and a cam having a lobe720 thereon. The lever arm 460 (shown in FIG. 4) is attached to the axis710 of the cam 700. By moving the lever arm 460 the cam 700 is movedfrom a position where the lobe 720 is directed away from the end slot450 to a position where the lobe 720 is positioned toward the end slot450 on the socket 400.

The operation of the socket 400 and package 200 will now be discussedwith respect to FIGS. 2-4, and 7. In operation, the land grid arraypackage 200 is placed into the opening 412 of the socket 400. Theoverhangs 440, 442 are spaced such that they fit between the scallopedindents 220, 222 of the land grid array package 200. In other words, thescalloped edges 220, 222 of the land grid array package fit past theoverhangs 440, 442 along the edges of the opening 412. Initially, theland grid array package 200 is placed in the opening 412 of the socket400. In its initial position, the solid end 230 of the land grid arraypackage 200 is not engaged with the slot 450 of the socket 400, and thelobe 720 of the cam 700 is positioned away from the slot 450. The nextstep is to move the lever arm 460 to turn the lobe 720 toward the slot450. The lobe 720 acts on the edge 250 of the land grid array package200 and forces the solid end 230 into the slot 450 of the socket 400.Moving the package 200 into the slot 450 also causes the scalloped edges220, 222 to be captured by the overhangs 440, 442. The slanted or slopededge of the overhang 440, 442 places a peripheral force above the edgeof the package 200 as the land grid array package 200 is forced into theslot 450. In other words, the cam 700 forces the land grid array package200 into the slot and forces the land grid array package 200 underneaththe overhang 440, 442 of the socket 400. This results in the solid end230 being forced into the slot 450 as well as the overhangs 440, 442placing an additional force on the scalloped edges 220, 222 of the landgrid array package 200. The overhangs 440, 442 therefore produce anevenly distributed force about the periphery of the package 200 and alsoproduce a good contact for transmission of current levels associatedwith powering the electronics of the die 120. By moving the land gridarray package 200 across the contacts 430, 630 the wiping distance islengthened while an increasing amount of force is placed onto the die.Good, reliable electrical contact between the package 200 and the socket400 is assured since the wiping distance is increased. Good electricalcontact between the package 200 and the socket 400 is also assured sincethe force between the package 200 and the socket 400 is also increased.Increasing force between the package 200 and socket 400 assures that anyoxide layer on the land 310 is penetrated to produce a good electricalcontact.

The structure and method of this invention has many advantages. Amongthe advantages is that the structure meets a growing demand for highloads and evenly distributed loads on a die package. The structure iscapable of carrying high loads and distributing these loadssubstantially evenly over the die package since the structure uses aseparate slot, and separates the current carrying function from thelands of the land grid array package. Thus, the land grid arraypackaging method and apparatus described allows for higher currentcarrying portions, mainly for delivering power to the die, in thesimple, high contact density, low inductance land grid array package.The problem of a short wiping distance is eliminated because the wipingdistance is lengthened when the die package is moved vertically acrossthe socket and into the slot at one end of the base of the socket. Thelonger wiping distance assures a reliable, good electrical contactbetween the contacts in the socket and the individual lands of the diepackage.

FIG. 8 is a schematic view of a computer system. Advantageously, theinvention is well-suited for use in a computer system 2000. The computersystem 2000 may also be called an electronic system or an informationhandling system, and includes a central processing unit, a memory and asystem bus. The information handling system includes a centralprocessing unit 2004, a random access memory 2032, and a system bus 2030for communicatively coupling the central processing unit 2004 and therandom access memory 2032. The information handling system 2000 includesa disc drive device which includes the ramp described above. Theinformation handling system 2000 may also include an input/output bus2010 and several peripheral devices, such as 2012, 2014, 2016, 2018,2020, and 2022 may be attached to the input output bus 2010. Peripheraldevices may include hard disc drives, magneto optical drives, floppydisc drives, monitors, keyboards and other such peripherals. Any type ofdisc drive may use the method for loading or unloading the slider ontothe disc surface as described above.

In conclusion, a package for a semiconductor device includes a substratehaving a first major surface, a second major surface, a first scallopededge and a second scalloped edge. The package also has a solid endadapted for insertion into a slot. The first scalloped edge, the secondscalloped edge and the solid end carry currents greater than the currentneeded for an input/output signal. A plurality of electrical contactsare attached to one of the first major surface and the second majorsurface. A die is attached to the other of the first major surface andthe second major surface of the substrate. The plurality of electricalcontacts carry input/output signals. In some embodiments, the firstscalloped edge, the second scalloped edge and the solid end include goldplating to enhance the conductivity of current. The plurality ofelectrical contacts are lands. The die attached to the substrate is amicroprocessor.

A socket for a semiconductor device for use with the package includes abase having an opening therein adapted to receive a semiconductordevice. The base further includes a major planar surface located withinthe opening, and a plurality of electrical contacts attached to themajor planar surface. A slot is located at one end of the opening in thebase. The slot is provided with a plurality of conductors for carryingcurrents. The current carried by the conductors in the slot is greaterthan the current needed for input/output signals. A first edge of theopening includes a first overhang positioned over the major planarsurface within the opening, and a second edge of the opening includes asecond overhang positioned over the major planar surface within theopening. The first overhang and second overhang are sloped with respectto the major planar surface. In some embodiments, one or both of thefirst edge and second edge include a plurality of spaced overhangs. Thespace between the plurality of spaced overhangs is sufficient to allow apackage to pass the overhangs for insertion into the opening in thebase. In some embodiments, the plurality of electrical contacts attachedto the major planar surface are angled with respect to the major planarsurface. In other embodiments, the plurality of electrical contacts areattached to the major planar surface at a substantially perpendicularangle with respect to the major planar surface. The plurality ofelectrical contacts may have a spring therein. A cam is positioned on anedge of the socket. The cam has a cam surface that rotates about alever, wherein the distance between the socket and the cam surface islonger when the lever is in a first position, than when the cam surfaceis in a second position. In some embodiments, a stop for stopping thetravel of the lever is provided on the base of the socket. The pluralityof spaced overhangs on the first edge are also sloped so that thedistance between the major planar surface of the opening and aparticular overhang is smaller at the portion of the particular overhangnearer to the slot at one end of the opening in the base.

A system for providing electrical contacts between a die and anelectrical device includes a die and a package. The package includes afirst major surface, a second major surface, a first scalloped edge, asecond scalloped edge and a solid end adapted for insertion into a slot.The solid end carries current greater than the current needed for aninput/output signal. The package also includes a plurality of electricalcontacts attached to one of the first major surface and the second majorsurface, and a die attached to the other of the first major surface andthe second major surface of the substrate. The socket includes a basehaving an opening therein adapted to receive the package. The base alsoincludes a major planar surface located within the opening and aplurality of electrical contacts attached to the major planar surface. Aslot is located at one end of the opening in the base. The slot isprovided with a plurality of conductors for carrying currents greaterthan the current needed for an input/output signal. A first edge of theopening includes a plurality of spaced overhangs positioned over themajor planar surface within the opening, and a second edge of theopening including a plurality of spaced overhangs positioned over themajor planar surface within the opening. The overhangs are spaced tocorrespond to the first scalloped edge and the second scalloped edge ofthe package. The first overhang and the second overhang are both slopedwith respect to the major planar surface. The overhangs are sloped sothat at least one of the overhangs results in the distance between aportion nearer the slot being less than a portion of the overhang moredistal from the slot. The slope of the first overhang and secondoverhang forces the package toward the major planar surface of theopening when the package is moved toward the slot at one end of theopening. In some embodiments, the first overhang and the second overhangalso carry currents larger than the current needed for an input/outputsignal. The plurality of electrical contacts attached to one of thefirst major surface and the second major surface of the package carryinput/output signals. In some embodiments, the plurality of electricalcontacts attached to one of the major surfaces are lands arranged in anarray. A cam is positioned on an edge of the socket distant from theslot. The cam has a cam surface that rotates about a lever, wherein thedistance between the socket and the cam surface is longer when the leveris in a first position than when the cam surface is in a secondposition. When the cam is in a first position, the opening in the baseof the socket receives the package. When the cam is in a secondposition, the package is moved into electrical contact with the slot andthe plurality of contacts on the major planar surface of the opening.

A method of connecting a land grid array package to a correspondingsocket includes placing the package into the opening in the base of thesocket, and sliding the package over the major planar surface intoengagement with a slot in the socket. The method also includes sendinginput/output signals through the land contacts of the land grid arraypackage, the input/output signals having a first current levelassociated therewith, and sending currents larger than the input/outputsignals through the slot and portion of the package mating with theslot. The package further includes a first scalloped edge and a secondscalloped edge. The socket includes corresponding overhangs which allowthe package to pass by the overhangs when inserted into the opening inthe socket, but which are sandwiched between a major surface of theopening and the overhangs as the package slides toward a slot in thesocket. The method includes forcing the package into engagement with themajor planar surface of the opening as the package slides intoengagement with the slot. In some embodiments, the first scalloped edgeand the second scalloped edge of the package 200 and the correspondingoverhangs of the socket 400 are used to carry currents greater thanthose associated with input/output signals from the contacts of thepackage.

The structure and method of this invention has many advantages. Amongthe advantages is that the structure meets a growing demand for highloads and evenly distributed loads on a die package. The structure iscapable of carrying high loads and distributing these loadssubstantially evenly over the die package since the structure uses aseparate slot and separates the current carrying function from the landsof the land grid array package. Thus, the land grid array packagingmethod and apparatus described allows for higher current carryingportions, mainly for delivering power to the die, in the simple, highcontact density, low inductance land grid array package. The problem ofa short wiping distance is eliminated because the wiping distance islengthened when the die package is moved vertically across the socketand into the slot at one end of the base of the socket. The longerwiping distance assures a reliable, good electrical contact between thecontacts in the socket and the individual lands of the die package.

The foregoing description of the specific embodiments reveals thegeneral nature of the invention sufficiently that others can, byapplying current knowledge, readily modify and/or adapt it for variousapplications without departing from the generic concept, and thereforesuch adaptations and modifications are intended to be comprehendedwithin the meaning and range of equivalents of the disclosedembodiments.

It is to be understood that the phraseology or terminology employedherein is for the purpose of description and not of limitation.Accordingly, the invention is intended to embrace all such alternatives,modifications, equivalents and variations as fall within the spirit andbroad scope of the appended claims.

1. A system including a semiconductor device comprising: a substrate,further comprising: a first major surface; a second major surface; afirst scalloped edge; a second scalloped edge; and a solid end adaptedfor insertion into a slot, the first scalloped edge, the secondscalloped edge and the solid end for carrying currents larger than thecurrent needed for a signal; a plurality of electrical contacts attachedto one of the first major surface and the second major surface; and adie attached to the other of the first major surface and the secondmajor surface of the substrate, the plurality of electrical contacts forcarrying input/output signals, and the first scalloped edge, the secondscalloped edge and the solid end for carrying currents greater than thecurrent needed for an input/output signal.
 2. The system of claim 1,wherein the first scalloped edge, the second scalloped edge and thesolid end include gold plating to enhance the conductivity of current.3. The system of claim 1, wherein the plurality of electrical contactsare lands.
 4. The system of claim 1, wherein the die attached to thesubstrate includes a microprocessor.
 5. The system of claim 1, whereinthe die attached to the substrate is a microprocessor.
 6. The system ofclaim 5, wherein the solid end adapted for insertion into a slot carriesa current to power the microprocessor attached to the substrate.
 7. Thesystem of claim 1, wherein the solid end adapted for insertion into aslot carries a current to power the die attached to the substrate.
 8. Asystem for providing electrical contacts between a die and an electricaldevice, the system comprising: a package further comprising: a firstmajor surface; a second major surface; a first scalloped edge; a secondscalloped edge; a solid end adapted for insertion into a slot, the solidend for carrying currents larger than the current needed for aninput/output signal; a plurality of electrical contacts attached to oneof the first major surface and the second major surface; and a dieattached to the other of the first major surface and the second majorsurface of the substrate; and a socket comprising: a base having anopening therein adapted to receive a package, the base furthercomprising: a major planar surface located within the opening; aplurality of electrical contacts attached to the major planar surface; aslot located at one end of the opening in the base, the slot providedwith a plurality of conductors for carrying currents greater than thecurrent needed for an input/output signal; a first edge of the openingincluding a plurality of spaced overhangs positioned over the majorplanar surface within the opening; and a second edge of the openingincluding a plurality of spaced overhangs positioned over the majorplanar surface within the opening, wherein the overhangs are spaced tocorrespond to the first scalloped edge and the second scalloped edge ofthe package.
 9. The system of claim 8, wherein the first overhang andsecond overhang are sloped with respect to the major planar surface. 10.The system of claim 8, wherein the first overhang and second overhangare sloped with respect to the major planar surface, wherein the slopeof at least one of the overhangs results in the distance between aportion nearer the slot being less than a portion of the overhang moredistal from the slot.
 11. The system of claim 9, wherein the firstoverhang and second overhang are sloped so as to force the packagetoward the major planar surface of the opening when the package is movedtoward the slot at one end of the opening.
 12. The system of claim 8,wherein the first overhang and second overhang carry currents largerthan the current needed for an input/output signal.
 13. The system ofclaim 12, wherein the plurality of electrical contacts attached to oneof the first major surface and the second major surface of the packagecarry input/output signals.
 14. The system of claim 8, wherein theplurality of electrical contacts attached to one of the first majorsurface are lands arranged in an array.
 15. The system of claim 8,further comprising a cam positioned on an edge of the socket distantfrom the slot, the cam having a cam surface that rotates about a lever,wherein the distance between the socket and the cam surface is longerwhen the lever is in a first position than when the cam surface is in asecond position.
 16. The system of claim 15, wherein the cam is in afirst position to allow the package to be placed into the opening in thebase of the socket, and in a second position to place the package intoelectrical contact with the slot and the plurality of contacts on themajor planar surface of the opening.
 17. A method of connecting a landgrid array package including an array of land contacts to acorresponding socket comprising: placing the package into the opening inthe base of the socket; sliding the package over the major planarsurface into engagement with a slot in the socket; sending input/outputsignals through the land contacts of the land grid array package, theinput/output signals having a first current level associated therewith;and sending currents greater than the input/output signals through theslot and portion of the package mating with the slot.
 18. The method ofclaim 17, wherein the package further comprises a first scalloped edgeand a second scalloped edge, and the socket includes correspondingoverhangs which allow the package to pass by the overhangs wheninserted, but which are sandwiched between a major surface of theopening and the overhangs as the package slides toward a slot in thesocket, the method further comprising forcing the package intoengagement with the major planar surface of the opening as the packageslides into engagement with the slot.
 19. The method of claim 17,wherein the first scalloped edge and the second scalloped edge of thepackage, and the corresponding overhangs socket, are used to carrycurrents greater than those associated with input/output signals fromthe contacts of the package.
 20. The method of connecting a land gridarray package of claim 17 further comprising connecting a die to thepackage.
 21. The method of connecting a land grid array package of claim17 further comprising connecting a microprocessor to the package.